Technological Innovations in Core Conductive Structures
Integrated Solder-Free Copper Strip Technology: Eliminates traditional soldering by using a single piece of phosphor bronze, stamped and formed as a unified unit. The socket contacts and conductors are fully integrated, significantly reducing contact resistance and extending the plug-unplug lifespan beyond 10,000 cycles; this completely eliminates risks associated with cold solder joints or overheating caused by solder joint oxidation.
Innovative Hook-and-Lock Interlocking Process: Achieves a mechanical hook-and-lock connection between the power cord and internal copper components, replacing traditional crimping or soldering methods. This increases connection strength by 40%, prevents loosening or poor contact during long-term use, and ensures temperature rise performance far superior to national standards.
End-to-End Automated and Digital Manufacturing
"UNTOUCH" Unmanned Production Model: Covers the entire chain-including mold making, injection molding, stamping, electroplating, and automated assembly/testing-without any manual handling of materials. Quality is controlled via CCD vision and sensor technologies, maintaining a 99.9% yield rate even in scenarios involving small-batch, multi-specification production.
Intelligent Component Insertion Line Innovation: Utilizes multi-axis visual positioning systems to control component insertion timing with millisecond precision. Combined with in-line Automated Optical Inspection (AOI)-replacing traditional manual visual checks-this boosts solder joint defect detection accuracy to 99.7% while drastically reducing emissions of solder dross and volatile pollutants.
